The TO-39 Bipolar Junction Transistor is a through hole packaged device with a TO-205-AD package family name and a transistor outline package description. It has a maximum package height and seated plane height of 6.6mm and a maximum package diameter of 9.4mm. The device is made of metal and has a pin pitch of 2.54mm. It is a 3-pin device with a lead shape of through hole and a mounted type of through hole. The transistor is made of silicon material and has a Jedec code of TO-205AD.
PackageTO-39
MountingThrough Hole
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Technical Specifications
TT BSV64-JQR-A technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | TO-205-AD |
| Package/Case | TO-39 |
| Package Description | Transistor Outline Package |
| Lead Shape | Through Hole |
| Pin Count | 3 |
| PCB | 3 |
| Package Height (mm) | 6.6(Max) |
| Seated Plane Height (mm) | 6.6(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Diameter (mm) | 9.4(Max) |
| Package Material | Metal |
| Mounting | Through Hole |
| Jedec | TO-205AD |
| Material | Si |
Compliance
| Cage Code | 57027, 73138,U1395 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
TT BSV64-JQR-A Datasheet
Download the complete datasheet for TT BSV64-JQR-A to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.