PackageTO-39
MountingThrough Hole
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Technical Specifications
TT BSX63-JQR-B technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
TO-205-AD
Package/Case
TO-39
Package Description
Transistor Outline Package
Lead Shape
Through Hole
Pin Count
3
PCB
3
Package Height (mm)
6.6(Max)
Seated Plane Height (mm)
6.6(Max)
Pin Pitch (mm)
2.54
Package Diameter (mm)
9.4(Max)
Package Material
Metal
Mounting
Through Hole
Jedec
TO-205AD
Compliance
Cage Code
57027, 73138,U1395
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
TT BSX63-JQR-B Datasheet
Download the complete datasheet for TT BSX63-JQR-B to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.