Res Thin Film 1206 470K Ohm 5% 1/4W 50ppm/C 0.01% Molded SMD SMD Waffle Pack
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| Case Code (Imperial) | 1206 |
| Case Code (Metric) | 3216 |
| Package/Case | 1206 |
| Contact Plating | Tin, Lead |
| Failure Rate | 0.01% |
| Features | Military |
| Height | 0.033inch |
| Length | 0.126inch |
| Max Operating Temperature | 150°C |
| Military Standard | MIL-PRF-55342 |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 250mW |
| Number of Terminations | 2 |
| Package Quantity | 1 |
| Packaging | Waffle |
| Radiation Hardening | No |
| Resistance | 470kR |
| RoHS Compliant | No |
| Series | Military, MIL-PRF-55342, RM1206 |
| Thickness | 381um |
| Tolerance | 5% |
| Width | 0.063inch |
| RoHS | Not CompliantNo |
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