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Technical Specifications
Vishay DG184AP/883L technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
SBCDIP
Package Description
Side Brazed Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
16
PCB
16
Package Length (mm)
21.08(Max)
Package Width (mm)
7.87(Max)
Package Height (mm)
3.05(Max)
Seated Plane Height (mm)
4.45(Max)
Pin Pitch (mm)
2.54
Package Material
Ceramic
Mounting
Through Hole
Jedec
MS-015AC
Compliance
Cage Code
18612
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Vishay DG184AP/883L Datasheet
Download the complete datasheet for Vishay DG184AP/883L to view detailed technical specifications.
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