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Technical Specifications
Winbond W25Q128FWEIG technical specifications.
General
Access Time-Max
7.5ns
Address Bus Width
24b
Density
128Mb
Interface
SPI, Serial
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
1.95V
Memory Type
FLASH, , NOR
Min Supply Voltage
1.7V
Mount
Surface Mount
Number of Words
16777216
Operating Supply Voltage
1.8V
Package Quantity
63
Packaging
Rail/Tube
Page Size
256B
Radiation Hardening
No
RoHS Compliant
Yes
Series
SpiFlash®
Supply Current
20mA
Sync/Async
Synchronous
Word Size
8b
Compliance
RoHS
Compliant
Datasheet
Winbond W25Q128FWEIG Datasheet
Download the complete datasheet for Winbond W25Q128FWEIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.