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Technical Specifications
Winbond W25Q64FVZPIG technical specifications.
General
| Access Time-Max | 8.5ns |
| Address Bus Width | 1b |
| Package/Case | SOIC |
| Density | 64Mb |
| Frequency | 104MHz |
| Height | 800um |
| Interface | SPI, Serial |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 3.6V |
| Memory Size | 64Mb |
| Memory Type | Non-Volatile, , FLASH, NOR |
| Min Supply Voltage | 2.7V |
| Mount | Surface Mount |
| Operating Supply Voltage | 3V |
| Packaging | Rail/Tube |
| Page Size | 256B |
| Radiation Hardening | No |
| Series | SpiFlash® |
| Supply Current | 40mA |
| Sync/Async | Synchronous |
| Word Size | 8b |
Compliance
| RoHS | Not CompliantNo |
Datasheet
Winbond W25Q64FVZPIG Datasheet
Download the complete datasheet for Winbond W25Q64FVZPIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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