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Technical Specifications
Winbond W25Q64FWSSIG technical specifications.
General
| Access Time-Max | 6ns |
| Address Bus Width | 24b |
| Package/Case | SOIC |
| Density | 67108864b |
| Frequency | 104MHz |
| Height | 2.16mm |
| Interface | SPI, Serial |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 1.95V |
| Memory Size | 64Mb |
| Memory Type | Non-Volatile, , FLASH, NOR |
| Min Supply Voltage | 1.65V |
| Mount | Surface Mount |
| Operating Supply Voltage | 1.8V |
| Packaging | Rail/Tube |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | SpiFlash® |
| Supply Current | 20mA |
| Sync/Async | Synchronous |
| Word Size | 8b |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W25Q64FWSSIG Datasheet
Download the complete datasheet for Winbond W25Q64FWSSIG to view detailed technical specifications.
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