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Technical Specifications
Winbond W25Q64FWSSIGTR technical specifications.
General
Package/Case
SOIC
Interface
SPI, Serial
Max Operating Temperature
85°C
Memory Type
FLASH,
Min Operating Temperature
-40°C
Package Quantity
2000
Packaging
Tape and Reel
Series
SpiFlash®
Compliance
RoHS
Compliant
Datasheet
Winbond W25Q64FWSSIGTR Datasheet
Download the complete datasheet for Winbond W25Q64FWSSIGTR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.