Frequency104MHz
PackageSOIC
Current18mA
MountingSurface Mount
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Technical Specifications
Winbond W25Q80BVSSIG technical specifications.
General
Access Time-Max
8.5ns
Address Bus Width
1b
Package/Case
SOIC
Density
8Mb
Frequency
104MHz
Interface
SPI, Serial
Max Operating Temperature
85°C
Memory Size
8Mb
Memory Type
Non-Volatile, , FLASH
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Min Supply Voltage
2.7V
Mount
Surface Mount
Operating Supply Voltage
3.3V
Packaging
Rail/Tube
Page Size
256B
Radiation Hardening
No
RoHS Compliant
Yes
Series
SpiFlash®
Supply Current
18mA
Sync/Async
Synchronous, Asynchronous
Word Size
8b
Compliance
RoHS
Compliant
Datasheet
Winbond W25Q80BVSSIG Datasheet
Download the complete datasheet for Winbond W25Q80BVSSIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.