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Technical Specifications
Winbond W25X10CLSNIG technical specifications.
General
Access Time-Max
8ns
Address Bus Width
24b
Package/Case
SOIC
Density
1Mb
Interface
SPI, Serial
Max Operating Temperature
85°C
Memory Type
FLASH, , NOR
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Min Supply Voltage
2.3V
Mount
Surface Mount
Number of Words
128000
Package Quantity
100
Packaging
Rail/Tube
Radiation Hardening
No
RoHS Compliant
Yes
Series
SpiFlash®
Supply Current
14mA
Sync/Async
Synchronous
Compliance
RoHS
Compliant
Datasheet
Winbond W25X10CLSNIG Datasheet
Download the complete datasheet for Winbond W25X10CLSNIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.