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Technical Specifications
Winbond W25X10CLSNIG technical specifications.
General
| Access Time-Max | 8ns |
| Address Bus Width | 24b |
| Package/Case | SOIC |
| Density | 1Mb |
| Interface | SPI, Serial |
| Max Operating Temperature | 85°C |
| Memory Type | FLASH, , NOR |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 2.3V |
| Mount | Surface Mount |
| Number of Words | 128000 |
| Package Quantity | 100 |
| Packaging | Rail/Tube |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | SpiFlash® |
| Supply Current | 14mA |
| Sync/Async | Synchronous |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W25X10CLSNIG Datasheet
Download the complete datasheet for Winbond W25X10CLSNIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.