Frequency75MHz
PackageSOIC
Current20mA
MountingSurface Mount
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Technical Specifications
Winbond W25X16AVSSIG technical specifications.
General
Access Time-Max
7ns
Address Bus Width
24b
Package/Case
SOIC
Density
16Mb
Frequency
75MHz
Interface
SPI, Serial
Max Operating Temperature
85°C
Min Operating Temperature
-40°C
Max Supply Voltage
3.6V
Memory Size
16Mb
Memory Type
Non-Volatile, , FLASH
Min Supply Voltage
2.7V
Mount
Surface Mount
Operating Supply Voltage
3.3V
Page Size
256B
Radiation Hardening
No
RoHS Compliant
Yes
Series
SpiFlash®
Supply Current
20mA
Sync/Async
Synchronous
Word Size
8b
Compliance
RoHS
Compliant
Datasheet
Winbond W25X16AVSSIG Datasheet
Download the complete datasheet for Winbond W25X16AVSSIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.