Quick Jump:
Technical Specifications
Winbond W25X64VSFIG technical specifications.
General
| Access Time-Max | 7ns |
| Address Bus Width | 23b |
| Package/Case | SOIC |
| Density | 64Mb |
| Frequency | 75MHz |
| Interface | SPI, Serial |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Max Supply Voltage | 3.6V |
| Memory Size | 64Mb |
| Memory Type | Non-Volatile, , FLASH |
| Min Supply Voltage | 2.7V |
| Mount | Surface Mount |
| Operating Supply Voltage | 3.3V |
| Packaging | Rail/Tube |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Series | SpiFlash® |
| Supply Current | 18mA |
| Sync/Async | Synchronous |
| Word Size | 8b |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W25X64VSFIG Datasheet
Download the complete datasheet for Winbond W25X64VSFIG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
