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Technical Specifications
Winbond W29GL128CH9T technical specifications.
General
| Access Time | 90ns |
| Access Time-Max | 100ns |
| Address Bus Width | 23b |
| Package/Case | TSOP |
| Density | 18Mb |
| Interface | Parallel |
| Lead Free | Lead Free |
| Max Operating Temperature | 85°C |
| Max Supply Voltage | 3.6V |
| Memory Size | 128Mb |
| Memory Type | Non-Volatile, , FLASH |
| Min Operating Temperature | -40°C |
| Min Supply Voltage | 2.7V |
| Mount | Surface Mount |
| Packaging | Rail/Tube |
| Page Size | 256B |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Supply Current | 55mA |
| Sync/Async | Asynchronous |
| Word Size | 1b |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W29GL128CH9T Datasheet
Download the complete datasheet for Winbond W29GL128CH9T to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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