1Gbit DDR3 SDRAM memory chip, organized as 64Mx16, featuring a 16-bit data bus width and a maximum clock rate of 1333 MHz. This surface-mount component utilizes a 96-pin WBGA package with a 0.8mm pin pitch, measuring 13mm x 9mm x 0.8mm. Operating at a typical 1.5V supply voltage, it offers 8 internal banks and 8M words per bank, with a maximum access time of 0.255 ns. Extended temperature range from -40°C to 95°C.
PackageWBGA
MountingSurface Mount
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Technical Specifications
Winbond W631GG6KB15I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WBGA
Lead Shape
Ball
Pin Count
96
PCB
96
Package Length (mm)
13
Package Width (mm)
9
Package Height (mm)
0.8(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Density
1Gbit
Type
DDR3 SDRAM
Organization
64Mx16
Data Bus Width
16bit
Maximum Clock Rate
1333MHz
Number of Internal Banks
8
Number of Words per Bank
8M
Maximum Access Time
0.255ns
Density in Bits
1073741824bit
Address Bus Width
16bit
Maximum Operating Current
240mA
Typical Operating Supply Voltage
1.5V
Max Operating Supply Voltage
1.575V
Min Operating Supply Voltage
1.425V
Min Operating Temperature
-40°C
Max Operating Temperature
95°C
Compliance
Cage Code
SDM39
EU RoHS
Yes
HTS Code
8542320032
Schedule B
8542320015
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Winbond W631GG6KB15I Datasheet
Download the complete datasheet for Winbond W631GG6KB15I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.