1Gbit DDR3 SDRAM memory chip, organized as 64Mx16, featuring a 16-bit data bus width and a maximum clock rate of 1333 MHz. This surface-mount component utilizes a 96-pin WBGA package with a 0.8mm pin pitch, measuring 13mm x 9mm x 0.8mm. Operating at a typical 1.5V supply voltage, it offers 8 internal banks and 8M words per bank, with a maximum access time of 0.255 ns. Extended temperature range from -40°C to 95°C.
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Winbond W631GG6KB15I technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WBGA |
| Lead Shape | Ball |
| Pin Count | 96 |
| PCB | 96 |
| Package Length (mm) | 13 |
| Package Width (mm) | 9 |
| Package Height (mm) | 0.8(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 1Gbit |
| Type | DDR3 SDRAM |
| Organization | 64Mx16 |
| Data Bus Width | 16bit |
| Maximum Clock Rate | 1333MHz |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 8M |
| Maximum Access Time | 0.255ns |
| Density in Bits | 1073741824bit |
| Address Bus Width | 16bit |
| Maximum Operating Current | 240mA |
| Typical Operating Supply Voltage | 1.5V |
| Max Operating Supply Voltage | 1.575V |
| Min Operating Supply Voltage | 1.425V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 95°C |
| Cage Code | SDM39 |
| EU RoHS | Yes |
| HTS Code | 8542320032 |
| Schedule B | 8542320015 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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