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Winbond W947D6HBHX5ITR technical specifications.
| Package/Case | TFBGA |
| Interface | Parallel |
| Max Operating Temperature | 85°C |
| Memory Type | RAM, , SDRAM, LPDDR |
| Min Operating Temperature | -40°C |
| Packaging | Tape and Reel |
| RoHS | Compliant |
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