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Technical Specifications
Winbond W971GG6JB-18 technical specifications.
General
| Access Time-Max | 0.35ns |
| Address Bus Width | 16b |
| Package/Case | TFBGA |
| Data Bus Width | 16b |
| Density | 1Gb |
| Interface | Parallel |
| Max Frequency | 1.066GHz |
| Max Operating Temperature | 85°C |
| Max Supply Voltage | 1.9V |
| Memory Type | RAM, , DDR2 SDRAM |
| Min Operating Temperature | 0°C |
| Min Supply Voltage | 1.7V |
| Mount | Surface Mount |
| Operating Supply Voltage | 1.8V |
| Organization | 64MX16 |
| Package Quantity | 209 |
| Packaging | Tray |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Supply Current | 160mA |
Compliance
| RoHS | Compliant |
Datasheet
Winbond W971GG6JB-18 Datasheet
Download the complete datasheet for Winbond W971GG6JB-18 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.