Frequency1.066GHz
PackageTFBGA
Current160mA
MountingSurface Mount
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Technical Specifications
Winbond W971GG6JB-18 technical specifications.
General
Access Time-Max
0.35ns
Address Bus Width
16b
Package/Case
TFBGA
Data Bus Width
16b
Density
1Gb
Interface
Parallel
Max Frequency
1.066GHz
Max Operating Temperature
85°C
Max Supply Voltage
1.9V
Memory Type
RAM, , DDR2 SDRAM
Min Operating Temperature
0°C
Min Supply Voltage
1.7V
Mount
Surface Mount
Operating Supply Voltage
1.8V
Organization
64MX16
Package Quantity
209
Packaging
Tray
Radiation Hardening
No
RoHS Compliant
Yes
Supply Current
160mA
Compliance
RoHS
Compliant
Datasheet
Winbond W971GG6JB-18 Datasheet
Download the complete datasheet for Winbond W971GG6JB-18 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.