16Mbit SDRAM chip, organized as 1Mx16, featuring a 16-bit data bus and 12-bit address bus. Operates at a maximum clock rate of 166 MHz with 2 internal banks, each containing 512K words. Packaged in a 60-pin VFBGA (Very Thin Fine Pitch Ball Grid Array) with a 0.65mm pin pitch, measuring 10.1mm x 6.4mm x 0.66mm. Supports surface mount installation and operates from a 3V to 3.6V supply voltage, with a typical of 3.3V.
PackageVFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Winbond W9816G6IB-6 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
VFBGA
Package Description
Very Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
60
PCB
60
Package Length (mm)
10.1
Package Width (mm)
6.4
Package Height (mm)
0.66
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Density
16Mbit
Type
SDRAM
Organization
1Mx16
Data Bus Width
16bit
Maximum Clock Rate
166MHz
Number of Internal Banks
2
Number of Words per Bank
512K
Maximum Access Time
5.5|5ns
Density in Bits
16777216bit
Address Bus Width
12bit
Maximum Operating Current
110mA
Typical Operating Supply Voltage
3.3V
Max Operating Supply Voltage
3.6V
Min Operating Supply Voltage
3V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
SDM39
EU RoHS
Yes
HTS Code
8542320002
Schedule B
8542320015
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Winbond W9816G6IB-6 Datasheet
Download the complete datasheet for Winbond W9816G6IB-6 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.