64Mbit SDRAM chip, organized as 4Mx16, featuring a 16-bit data bus width and a maximum clock rate of 166 MHz. This surface-mount component utilizes a 60-pin VFBGA package with a 0.65mm pin pitch, measuring 10.1mm x 6.4mm x 0.73mm. It operates at a typical supply voltage of 3.3V, with four internal banks and 1M words per bank.
PackageVFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Winbond W9864G6JB-6 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
VFBGA
Package Description
Very Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
60
PCB
60
Package Length (mm)
10.1
Package Width (mm)
6.4
Package Height (mm)
0.73(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Density
64Mbit
Type
SDRAM
Organization
4Mx16
Data Bus Width
16bit
Maximum Clock Rate
166MHz
Number of Internal Banks
4
Number of Words per Bank
1M
Maximum Access Time
6|5ns
Density in Bits
67108864bit
Address Bus Width
14bit
Maximum Operating Current
75mA
Typical Operating Supply Voltage
3.3V
Max Operating Supply Voltage
3.6V
Min Operating Supply Voltage
3V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
SDM39
EU RoHS
Yes
HTS Code
8542320002
Schedule B
8542320015
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Winbond W9864G6JB-6 Datasheet
Download the complete datasheet for Winbond W9864G6JB-6 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.