64Mbit SDRAM memory chip, organized as 4Mx16, featuring a 16-bit data bus and a maximum clock rate of 166 MHz. This surface-mount component utilizes a 60-pin VFBGA package with a 0.65mm pin pitch, measuring 10.1mm x 6.4mm x 0.73mm. It operates with a typical supply voltage of 3.3V, offering 4 internal banks and 1M words per bank. The chip supports a maximum access time of 6ns or 5ns, with an operating temperature range of -40°C to 85°C.
PackageVFBGA
MountingSurface Mount
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Technical Specifications
Winbond W9864G6JB-6I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | VFBGA |
| Package Description | Very Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 60 |
| PCB | 60 |
| Package Length (mm) | 10.1 |
| Package Width (mm) | 6.4 |
| Package Height (mm) | 0.73(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 64Mbit |
| Type | SDRAM |
| Organization | 4Mx16 |
| Data Bus Width | 16bit |
| Maximum Clock Rate | 166MHz |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 1M |
| Maximum Access Time | 6|5ns |
| Density in Bits | 67108864bit |
| Address Bus Width | 14bit |
| Maximum Operating Current | 75mA |
| Typical Operating Supply Voltage | 3.3V |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Supply Voltage | 3V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | SDM39 |
| EU RoHS | Yes |
| HTS Code | 8542320002 |
| Schedule B | 8542320015 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Winbond W9864G6JB-6I Datasheet
Download the complete datasheet for Winbond W9864G6JB-6I to view detailed technical specifications.
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