The XC17S30APDG8I is an 8-pin dual-in-line package (DIP) industrial temperature configuration memory IC from Xilinx. It operates over a temperature range of -40 to 85 degrees Celsius and has a nominal supply voltage of 3.3V. The device has 336768 words of configuration memory and is accessed serially. It is packaged in a 7.62mm wide and 9.3599mm long DIP package with a terminal position of dual. The IC is designed for industrial applications.
Xilinx XC17S30APDG8I technical specifications.
| Max Operating Temperature | 85 |
| Number of Terminals | 8 |
| Min Operating Temperature | -40 |
| Terminal Position | DUAL |
| JEDEC Package Code | R-PDIP-T8 |
| Width | 7.62 |
| Length | 9.3599 |
| Pin Count | 8 |
| Number of Functions | 1 |
| Temperature Grade | INDUSTRIAL |
| Supply Voltage-Nom (Vsup) | 3.3 |
| Supply Voltage-Max (Vsup) | 3.6 |
| Supply Voltage-Min (Vsup) | 3 |
| Number of Words | 336768 |
| Number of Words Code | 336768 |
| Memory IC Type | CONFIGURATION MEMORY |
| Parallel/Serial | SERIAL |
| RoHS | Yes |
| Eccn Code | EAR99 |
| Lead Free | Yes |
| HTS Code | 8542.32.00.51 |
| REACH | Compliant |
| Military Spec | False |
No datasheet is available for this part.
