The XC3S2000-4FGG900C is a Field Programmable Gate Array (FPGA) from Xilinx, featuring 900 terminals and a maximum operating temperature of 85 degrees Celsius. It operates within a supply voltage range of 1.14 to 1.26 volts and has a maximum clock frequency of 630 MHz. The device is packaged in a 31 x 31 mm, lead-free, 900-pin Flip Chip Ball Grid Array (FBGA) and has 565 outputs and 565 inputs. It is suitable for use in a variety of applications, including those requiring high-performance digital signal processing and data processing.
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Technical Specifications
Xilinx XC3S2000-4FGG900C technical specifications.
General
| Max Operating Temperature | 85 |
| Number of Terminals | 900 |
| Min Operating Temperature | 0 |
| Terminal Position | BOTTOM |
| JEDEC Package Code | S-PBGA-B900 |
| Width | 31 |
| Length | 31 |
| Pin Count | 900 |
| Temperature Grade | OTHER |
| Supply Voltage-Nom | 1.2 |
| Supply Voltage-Min | 1.14 |
| Supply Voltage-Max | 1.26 |
| Number of Outputs | 565 |
| Clock Frequency-Max | 630 |
| Number of Inputs | 565 |
Compliance
| RoHS | Yes |
| Eccn Code | 3A991.D |
| Lead Free | Yes |
| HTS Code | 8542.39.00.01 |
| REACH | Compliant |
| Military Spec | False |
Datasheet
Xilinx XC3S2000-4FGG900C Datasheet
Download the complete datasheet for Xilinx XC3S2000-4FGG900C to view detailed technical specifications.
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