The XC3S5000-4FG676C is a Field Programmable Gate Array (FPGA) manufactured by Xilinx. It has a maximum operating temperature of 85 degrees Celsius and a minimum operating temperature of 0 degrees Celsius. The device is packaged in a 27 x 27 mm, 676-pin Flip Chip Ball Grid Array (FBGA) package. It operates on a nominal supply voltage of 1.2V, with a minimum supply voltage of 1.14V and a maximum supply voltage of 1.26V. The FPGA has 489 outputs and 489 inputs, with a maximum clock frequency of 630 MHz.
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Xilinx XC3S5000-4FG676C technical specifications.
| Max Operating Temperature | 85 |
| Number of Terminals | 676 |
| Min Operating Temperature | 0 |
| Terminal Position | BOTTOM |
| JEDEC Package Code | S-PBGA-B676 |
| Width | 27 |
| Length | 27 |
| Pin Count | 676 |
| Temperature Grade | OTHER |
| Supply Voltage-Nom | 1.2 |
| Supply Voltage-Min | 1.14 |
| Supply Voltage-Max | 1.26 |
| Number of Outputs | 489 |
| Clock Frequency-Max | 630 |
| Number of Inputs | 489 |
| RoHS | No |
| Eccn Code | 3A991.D |
| Lead Free | No |
| HTS Code | 8542.39.00.01 |
| REACH | not_compliant |
| Military Spec | False |
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