Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. Features 4,824 Kbit of RAM, 360 18x18 multipliers, and 180 dedicated DSP blocks. Offers 106 maximum user I/Os and 18 DLLs/PLLs. Housed in a 196-pin Chip Scale Ball Grid Array (CSBGA) package, measuring 8x8x0.8mm with a 0.5mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX100-3CPG196C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 196 |
| PCB | 196 |
| Package Length (mm) | 8 |
| Package Width (mm) | 8 |
| Package Height (mm) | 0.8 |
| Seated Plane Height (mm) | 1 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 106 |
| Number of Registers | 126576 |
| RAM Bits | 4824Kbit |
| Device Logic Cells | 101261 |
| Process Technology | 45nm |
| Number of Multipliers | 360 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 180 |
| Speed Grade | 3 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 268 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Xilinx XC6SLX100-3CPG196C Datasheet
Download the complete datasheet for Xilinx XC6SLX100-3CPG196C to view detailed technical specifications.
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