Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. This device features 4824 Kbit of RAM, 360 18x18 multipliers, and 180 dedicated DSP blocks. It offers 102 user I/Os and 18 DLLs/PLLs, with transceiver speeds up to 3.2 Gbps. Packaged in a 144-pin TQFP (Thin Quad Flat Package) with a 0.5mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
PackageTQFP
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX100-3TQG144C technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
TQFP
Package Description
Thin Quad Flat Package
Lead Shape
Gull-wing
Pin Count
144
PCB
144
Package Length (mm)
20
Package Width (mm)
20
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BFB
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
102
Number of Registers
126576
RAM Bits
4824Kbit
Device Logic Cells
101261
Process Technology
45nm
Number of Multipliers
360 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
180
Speed Grade
3
Device Number of DLLs/PLLs
18
Total Number of Block RAM
268
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX100-3TQG144C Datasheet
Download the complete datasheet for Xilinx XC6SLX100-3TQG144C to view detailed technical specifications.
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