Field Programmable Gate Array (FPGA) with 101,261 logic cells and 126,576 registers, built on 45nm process technology. Features 4,824 Kbit RAM bits, 360 18x18 multipliers, and 180 dedicated DSP blocks. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. This surface-mount device is housed in a 484-pin Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch, measuring 23mm x 23mm x 1.7mm. Offers 296 maximum user I/Os and operates within a temperature range of 0°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX100T-3FGG484C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 484 |
| PCB | 484 |
| Package Length (mm) | 23 |
| Package Width (mm) | 23 |
| Package Height (mm) | 1.7 |
| Seated Plane Height (mm) | 2.2 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 296 |
| Number of Registers | 126576 |
| RAM Bits | 4824Kbit |
| Device Logic Cells | 101261 |
| Process Technology | 45nm |
| Number of Multipliers | 360 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 8 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 180 |
| PCI Blocks | 1 |
| Speed Grade | 3 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 268 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX100T-3FGG484C Datasheet
Download the complete datasheet for Xilinx XC6SLX100T-3FGG484C to view detailed technical specifications.
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