Field Programmable Gate Array (FPGA) featuring 101,261 logic cells and 126,576 registers, built on 45nm process technology. This device offers 4.824 Mbit of RAM, 360 integrated 18x18 multipliers, and 180 dedicated DSP slices. It includes 8 transceiver blocks operating at up to 3.2 Gbps, a PCI block, and 18 DLLs/PLLs. The FPGA is housed in a 256-pin Fine Pitch Thin Ball Grid Array (FTBGA) package, measuring 17x17x1 mm, designed for surface mounting. It supports a maximum of 186 user I/Os and operates within a temperature range of -40°C to 100°C.
PackageFTBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX100T-3FT256I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FTBGA
Package Description
Fine Pitch Thin Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAF-1
Family Name
Spartan®-6 LXT
Maximum Number of User I/Os
186
Number of Registers
126576
RAM Bits
4824Kbit
Device Logic Cells
101261
Process Technology
45nm
Number of Multipliers
360 (18x18)
Programmability
Yes
Transceiver Blocks
8
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
180
PCI Blocks
1
Speed Grade
3
Device Number of DLLs/PLLs
18
Total Number of Block RAM
268
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX100T-3FT256I Datasheet
Download the complete datasheet for Xilinx XC6SLX100T-3FT256I to view detailed technical specifications.
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