Field Programmable Gate Array (FPGA) with 147,443 logic cells and 184,304 registers, built on 45nm process technology. Features 4824 Kbit RAM, 360 18x18 multipliers, and 180 dedicated DSP blocks. This surface-mount device utilizes a 900-pin Fine Pitch Ball Grid Array (FBGA) package measuring 31x31x1.75mm with a 1mm pin pitch. Operates across a temperature range of -40°C to 100°C, offering 576 maximum user I/Os and 3.2 Gbps transceiver speed.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX150-3FGG900I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
900
PCB
900
Package Length (mm)
31
Package Width (mm)
31
Package Height (mm)
1.75
Seated Plane Height (mm)
2.25
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAN-1
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
576
Number of Registers
184304
RAM Bits
4824Kbit
Device Logic Cells
147443
Process Technology
45nm
Number of Multipliers
360 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
180
Speed Grade
3
Device Number of DLLs/PLLs
18
Total Number of Block RAM
268
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX150-3FGG900I Datasheet
Download the complete datasheet for Xilinx XC6SLX150-3FGG900I to view detailed technical specifications.
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