Field Programmable Gate Array (FPGA) with 147,443 logic cells and 184,304 registers, built on 45nm process technology. Features 4824 Kbit RAM, 360 18x18 multipliers, and 180 dedicated DSP slices. Offers 232 maximum user I/Os and 18 DLLs/PLLs. This surface mount device is housed in a 324-pin Chip Scale Ball Grid Array (CSBGA) package measuring 15x15x0.9mm with a 0.8mm pin pitch. Operates within a temperature range of 0°C to 85°C and supports transceiver speeds up to 3.2 Gbps.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX150-L1CSG324C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 15 |
| Package Width (mm) | 15 |
| Package Height (mm) | 0.9 |
| Seated Plane Height (mm) | 1.5(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 232 |
| Number of Registers | 184304 |
| RAM Bits | 4824Kbit |
| Device Logic Cells | 147443 |
| Process Technology | 45nm |
| Number of Multipliers | 360 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 180 |
| Speed Grade | 1L |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 268 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX150-L1CSG324C Datasheet
Download the complete datasheet for Xilinx XC6SLX150-L1CSG324C to view detailed technical specifications.
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