Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 232 maximum user I/Os, 576 Kbit RAM bits, and 64 integrated 18x18 multipliers. This device includes 32 dedicated DSP blocks and supports external memory interfaces for DDR, DDR2, DDR3, and LPDDR SDRAM. Operates within a temperature range of -40°C to 100°C. Packaged in a 324-pin CSBGA (Chip Scale Ball Grid Array) with a 0.8mm pin pitch, measuring 15mm x 15mm x 0.9mm, designed for surface mounting.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX16-2CSG324I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
15
Package Width (mm)
15
Package Height (mm)
0.9
Seated Plane Height (mm)
1.5(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Package Orientation
Yes
Package Orientation Marking Type
Dot
Jedec
MO-275KKAB-1
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
232
Number of Registers
18224
RAM Bits
576Kbit
Device Logic Cells
14579
Process Technology
45nm
Number of Multipliers
64 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
32
Speed Grade
2
External Memory Interface
DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM
Device Number of DLLs/PLLs
6
Total Number of Block RAM
32
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX16-2CSG324I Datasheet
Download the complete datasheet for Xilinx XC6SLX16-2CSG324I to view detailed technical specifications.
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