Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers. Features 576 Kbit of RAM, 64 dedicated 18x18 multipliers, and 32 dedicated DSP blocks. Operates on 1.2V with a 45nm process technology, offering up to 498 user I/Os and 3.2 Gbps transceiver speed. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with a 1mm pin pitch and dimensions of 27mm x 27mm x 1.73mm. Suitable for operation between 0°C and 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX16-2FG676C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 676 |
| PCB | 676 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 1.73 |
| Seated Plane Height (mm) | 2.23 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAL-1 |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 498 |
| Number of Registers | 18224 |
| RAM Bits | 576Kbit |
| Device Logic Cells | 14579 |
| Process Technology | 45nm |
| Number of Multipliers | 64 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 32 |
| Speed Grade | 2 |
| Device Number of DLLs/PLLs | 6 |
| Total Number of Block RAM | 32 |
Compliance
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX16-2FG676C Datasheet
Download the complete datasheet for Xilinx XC6SLX16-2FG676C to view detailed technical specifications.
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