Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 576 Kbit RAM, 64 (18x18) multipliers, and 32 dedicated DSP blocks. Offers 160 user I/Os and supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. This 225-pin CSBGA device operates at 1.2V, with a transceiver speed of 3.2 Gbps, and is designed for surface mounting. Operating temperature range is 0 °C to 85 °C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX16-3CSG225C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 225 |
| PCB | 225 |
| Package Length (mm) | 13 |
| Package Width (mm) | 13 |
| Package Height (mm) | 0.9 |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 160 |
| Number of Registers | 18224 |
| RAM Bits | 576Kbit |
| Device Logic Cells | 14579 |
| Process Technology | 45nm |
| Number of Multipliers | 64 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 32 |
| Speed Grade | 3 |
| External Memory Interface | DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM |
| Device Number of DLLs/PLLs | 6 |
| Total Number of Block RAM | 32 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX16-3CSG225C Datasheet
Download the complete datasheet for Xilinx XC6SLX16-3CSG225C to view detailed technical specifications.
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