Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers, built on 45nm process technology. Features 106 user I/Os, 576 Kbit RAM, and 64 integrated 18x18 multipliers. This device includes 32 dedicated DSP blocks and 32 Block RAMs, supporting transceiver speeds up to 3.2 Gbps. Packaged in a 196-pin Chip Scale Ball Grid Array (CSBGA) with 0.5mm pin pitch, it is designed for surface mounting and operates within a temperature range of -40°C to 100°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX16-L1CPG196I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
196
PCB
196
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
0.8
Seated Plane Height (mm)
1
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
106
Number of Registers
18224
RAM Bits
576Kbit
Device Logic Cells
14579
Process Technology
45nm
Number of Multipliers
64 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
32
Speed Grade
1L
Device Number of DLLs/PLLs
6
Total Number of Block RAM
32
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX16-L1CPG196I Datasheet
Download the complete datasheet for Xilinx XC6SLX16-L1CPG196I to view detailed technical specifications.
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