Field Programmable Gate Array (FPGA) with 14,579 logic cells and 18,224 registers. Features 576 Kbit RAM, 64 18x18 multipliers, and 32 dedicated DSP blocks. Operates with 232 user I/Os and 6 DLLs/PLLs. Utilizes 45nm process technology, offering 3.2 Gbps transceiver speed. Packaged in a 324-pin Chip Scale Ball Grid Array (CSBGA) for surface mounting, with dimensions of 15x15x0.9mm. Supports a wide operating temperature range of -40°C to 100°C.
PackageCSBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Xilinx XC6SLX16-L1CSG324I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
15
Package Width (mm)
15
Package Height (mm)
0.9
Seated Plane Height (mm)
1.5(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
232
Number of Registers
18224
RAM Bits
576Kbit
Device Logic Cells
14579
Process Technology
45nm
Number of Multipliers
64 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
32
Speed Grade
1L
Device Number of DLLs/PLLs
6
Total Number of Block RAM
32
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX16-L1CSG324I Datasheet
Download the complete datasheet for Xilinx XC6SLX16-L1CSG324I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.