Field Programmable Gate Array (FPGA) with 24051 logic cells and 30064 registers, built on 45nm process technology. Features 936 Kbit RAM, 76 (18x18) multipliers, and 38 dedicated DSP blocks. Offers 6 DLLs/PLLs and 52 Block RAMs, supporting external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. Operates at transceiver speeds up to 3.2 Gbps. Packaged in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) with a 17mm x 17mm footprint, suitable for surface mounting.
PackageFTBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Xilinx XC6SLX25-2FTG256C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FTBGA
Package Description
Fine Pitch Thin Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Package Orientation
Yes
Package Orientation Marking Type
Dot
Jedec
MS-034AAF-1
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
186
Number of Registers
30064
RAM Bits
936Kbit
Device Logic Cells
24051
Process Technology
45nm
Number of Multipliers
76 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
38
Speed Grade
2
External Memory Interface
DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM
Device Number of DLLs/PLLs
6
Total Number of Block RAM
52
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX25-2FTG256C Datasheet
Download the complete datasheet for Xilinx XC6SLX25-2FTG256C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.