Field Programmable Gate Array (FPGA) with 24,051 logic cells and 30,064 registers, built on 45nm process technology. Features 936 Kbit RAM, 76 18x18 multipliers, and 38 dedicated DSP blocks. Includes 2 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Packaged in a 196-pin Chip Scale Ball Grid Array (CSBGA) with a 0.5mm pin pitch, measuring 8x8x0.8mm, designed for surface mounting. Operates across a temperature range of -40°C to 100°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX25T-3CPG196I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
196
PCB
196
Package Length (mm)
8
Package Width (mm)
8
Package Height (mm)
0.8
Seated Plane Height (mm)
1
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LXT
Maximum Number of User I/Os
106
Number of Registers
30064
RAM Bits
936Kbit
Device Logic Cells
24051
Process Technology
45nm
Number of Multipliers
76 (18x18)
Programmability
Yes
Transceiver Blocks
2
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
38
PCI Blocks
1
Speed Grade
3
Device Number of DLLs/PLLs
6
Total Number of Block RAM
52
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX25T-3CPG196I Datasheet
Download the complete datasheet for Xilinx XC6SLX25T-3CPG196I to view detailed technical specifications.
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