Field Programmable Gate Array (FPGA) with 24,051 logic cells and 498 maximum user I/Os, built on 45nm process technology. Features 30,064 registers, 936 Kbit RAM bits, and 38 dedicated DSP slices. Includes 76 18x18 multipliers, 2 transceiver blocks operating at 3.2 Gbps, and 1 PCI block. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting, with an operating temperature range of -40°C to 100°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX25T-3FG676I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
676
PCB
676
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.73
Seated Plane Height (mm)
2.23
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAL-1
Family Name
Spartan®-6 LXT
Maximum Number of User I/Os
498
Number of Registers
30064
RAM Bits
936Kbit
Device Logic Cells
24051
Process Technology
45nm
Number of Multipliers
76 (18x18)
Programmability
Yes
Transceiver Blocks
2
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
38
PCI Blocks
1
Speed Grade
3
Device Number of DLLs/PLLs
6
Total Number of Block RAM
52
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX25T-3FG676I Datasheet
Download the complete datasheet for Xilinx XC6SLX25T-3FG676I to view detailed technical specifications.
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