Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers, built on 45nm process technology. Features 216 Kbit RAM, 16 integrated 18x18 multipliers, and 8 dedicated DSP blocks. Offers 132 user I/Os and supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. This surface-mount device is housed in a 225-pin Chip Scale Ball Grid Array (CSBGA) package measuring 13x13x0.9mm with a 0.8mm pin pitch, operating between 0°C and 85°C.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX4-2CSG225C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
225
PCB
225
Package Length (mm)
13
Package Width (mm)
13
Package Height (mm)
0.9
Seated Plane Height (mm)
1.4(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
132
Number of Registers
4800
RAM Bits
216Kbit
Device Logic Cells
3840
Process Technology
45nm
Number of Multipliers
16 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
8
Speed Grade
2
External Memory Interface
DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM
Device Number of DLLs/PLLs
6
Total Number of Block RAM
12
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX4-2CSG225C Datasheet
Download the complete datasheet for Xilinx XC6SLX4-2CSG225C to view detailed technical specifications.
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