Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers, built on 45nm process technology. Features 216 Kbit RAM, 16 integrated 18x18 multipliers, and 8 dedicated DSP blocks. Offers 576 maximum user I/Os and 6 DLLs/PLLs. This surface-mount device is housed in a 900-pin Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch, measuring 31x31mm with a 1.75mm height. Operates across a temperature range of -40°C to 100°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX4-3FGG900I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
900
PCB
900
Package Length (mm)
31
Package Width (mm)
31
Package Height (mm)
1.75
Seated Plane Height (mm)
2.25
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
576
Number of Registers
4800
RAM Bits
216Kbit
Device Logic Cells
3840
Process Technology
45nm
Number of Multipliers
16 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
8
Speed Grade
3
Device Number of DLLs/PLLs
6
Total Number of Block RAM
12
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX4-3FGG900I Datasheet
Download the complete datasheet for Xilinx XC6SLX4-3FGG900I to view detailed technical specifications.
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