Field Programmable Gate Array (FPGA) with 3840 logic cells and 4800 registers, featuring 216 Kbit RAM and 16 (18x18) multipliers. This device operates on 45nm process technology, supports transceiver speeds up to 3.2 Gbps, and includes 8 dedicated DSP slices. Packaged in a 256-pin Fine Pitch Thin Ball Grid Array (FTBGA) measuring 17x17x1 mm with a 1 mm pin pitch, it is designed for surface mounting. Operating temperature range is 0 °C to 85 °C.
PackageFTBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX4-3FTG256C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FTBGA
Package Description
Fine Pitch Thin Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAF-1
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
186
Number of Registers
4800
RAM Bits
216Kbit
Device Logic Cells
3840
Process Technology
45nm
Number of Multipliers
16 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
8
Speed Grade
3
Device Number of DLLs/PLLs
6
Total Number of Block RAM
12
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU
Datasheet
Xilinx XC6SLX4-3FTG256C Datasheet
Download the complete datasheet for Xilinx XC6SLX4-3FTG256C to view detailed technical specifications.
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