Field Programmable Gate Array (FPGA) with 43661 logic cells and 54576 registers, built on 45nm process technology. Features 2088 Kbit RAM, 116 multipliers (18x18), and 58 dedicated DSP blocks. Operates at 1.2V with a transceiver speed of 3.2 Gbps. Housed in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) package, measuring 17x17x1mm, for surface mounting. Offers 186 maximum user I/Os and operates within a temperature range of -40°C to 100°C.
PackageFTBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX45-2FTG256I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FTBGA |
| Package Description | Fine Pitch Thin Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 256 |
| PCB | 256 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.4 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAF-1 |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 186 |
| Number of Registers | 54576 |
| RAM Bits | 2088Kbit |
| Device Logic Cells | 43661 |
| Process Technology | 45nm |
| Number of Multipliers | 116 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 58 |
| Speed Grade | 2 |
| Device Number of DLLs/PLLs | 12 |
| Total Number of Block RAM | 116 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Xilinx XC6SLX45-2FTG256I Datasheet
Download the complete datasheet for Xilinx XC6SLX45-2FTG256I to view detailed technical specifications.
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