Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology. This device features 2,088 Kbit of RAM, 116 dedicated DSP blocks, and 116 Block RAMs, supporting up to 358 user I/Os. It operates at 1.2V and offers transceiver speeds of 3.2 Gbps. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) with a 1mm pin pitch, suitable for surface mounting. Operating temperature range is 0°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX45-3FG676C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
676
PCB
676
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.73
Seated Plane Height (mm)
2.23
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAL-1
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
358
Number of Registers
54576
RAM Bits
2088Kbit
Device Logic Cells
43661
Process Technology
45nm
Number of Multipliers
116 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
58
Speed Grade
3
Device Number of DLLs/PLLs
12
Total Number of Block RAM
116
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX45-3FG676C Datasheet
Download the complete datasheet for Xilinx XC6SLX45-3FG676C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.