Field Programmable Gate Array (FPGA) with 43,661 logic cells and 54,576 registers, built on 45nm process technology. This device features 2,088 Kbit of RAM, 116 dedicated DSP blocks, and 116 Block RAMs, supporting up to 358 user I/Os. It operates at 1.2V and offers transceiver speeds of 3.2 Gbps. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) with a 1mm pin pitch, suitable for surface mounting. Operating temperature range is 0°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX45-3FG676C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 676 |
| PCB | 676 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 1.73 |
| Seated Plane Height (mm) | 2.23 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAL-1 |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 358 |
| Number of Registers | 54576 |
| RAM Bits | 2088Kbit |
| Device Logic Cells | 43661 |
| Process Technology | 45nm |
| Number of Multipliers | 116 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 58 |
| Speed Grade | 3 |
| Device Number of DLLs/PLLs | 12 |
| Total Number of Block RAM | 116 |
Compliance
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX45-3FG676C Datasheet
Download the complete datasheet for Xilinx XC6SLX45-3FG676C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.