Field Programmable Gate Array (FPGA) featuring 43,661 logic cells and 54,576 registers, built on 45nm process technology. This device offers 2088 Kbit of RAM, 116 (18x18) multipliers, and 58 dedicated DSP slices. It includes 4 transceiver blocks operating at 3.2 Gbps and 1 PCI block. The FPGA is housed in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) package, measuring 17mm x 17mm x 1mm, designed for surface mounting. Operating temperature range is 0°C to 85°C.
PackageFTBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX45T-3FT256C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FTBGA
Package Description
Fine Pitch Thin Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAF-1
Family Name
Spartan®-6 LXT
Maximum Number of User I/Os
186
Number of Registers
54576
RAM Bits
2088Kbit
Device Logic Cells
43661
Process Technology
45nm
Number of Multipliers
116 (18x18)
Programmability
Yes
Transceiver Blocks
4
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
58
PCI Blocks
1
Speed Grade
3
Device Number of DLLs/PLLs
12
Total Number of Block RAM
116
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX45T-3FT256C Datasheet
Download the complete datasheet for Xilinx XC6SLX45T-3FT256C to view detailed technical specifications.
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