Field Programmable Gate Array (FPGA) featuring 43,661 logic cells and 54,576 registers, built on 45nm process technology. This device offers 2088 Kbit of RAM, 116 (18x18) multipliers, and 58 dedicated DSP slices. It includes 4 transceiver blocks operating at 3.2 Gbps and 1 PCI block. The FPGA is housed in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) package, measuring 17mm x 17mm x 1mm, designed for surface mounting. Operating temperature range is 0°C to 85°C.
PackageFTBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Xilinx XC6SLX45T-3FT256C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FTBGA |
| Package Description | Fine Pitch Thin Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 256 |
| PCB | 256 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1 |
| Seated Plane Height (mm) | 1.4 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAF-1 |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 186 |
| Number of Registers | 54576 |
| RAM Bits | 2088Kbit |
| Device Logic Cells | 43661 |
| Process Technology | 45nm |
| Number of Multipliers | 116 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 4 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 58 |
| PCI Blocks | 1 |
| Speed Grade | 3 |
| Device Number of DLLs/PLLs | 12 |
| Total Number of Block RAM | 116 |
Compliance
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX45T-3FT256C Datasheet
Download the complete datasheet for Xilinx XC6SLX45T-3FT256C to view detailed technical specifications.
No datasheet is available for this part.