Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, built on 45nm process technology. Features 3,096 Kbit RAM bits, 132 dedicated DSP slices, and 264 integrated 18x18 multipliers. Includes 8 transceiver blocks operating at 3.2 Gbps and 1 PCI block. Offered in a 676-pin Fine Pitch Ball Grid Array (FBGA) package, measuring 27mm x 27mm x 1.73mm, for surface mount applications. Supports 348 maximum user I/Os and operates within a temperature range of 0°C to 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75T-3FG676C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
676
PCB
676
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.73
Seated Plane Height (mm)
2.23
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAL-1
Family Name
Spartan®-6 LXT
Maximum Number of User I/Os
348
Number of Registers
93296
RAM Bits
3096Kbit
Device Logic Cells
74637
Process Technology
45nm
Number of Multipliers
264 (18x18)
Programmability
Yes
Transceiver Blocks
8
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
132
PCI Blocks
1
Speed Grade
3
Device Number of DLLs/PLLs
18
Total Number of Block RAM
172
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX75T-3FG676C Datasheet
Download the complete datasheet for Xilinx XC6SLX75T-3FG676C to view detailed technical specifications.
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