
Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, featuring 3096 Kbit RAM bits and 132 dedicated DSP slices. This device utilizes 45nm process technology and offers 264 (18x18) multipliers, 8 transceiver blocks operating at 3.2 Gbps, and 1 PCI block. It is housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package with a 1mm pin pitch, designed for surface mounting. Operating across a temperature range of -40°C to 100°C, this programmable component provides 348 maximum user I/Os and 172 total Block RAM.
Xilinx XC6SLX75T-3FG676I technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 676 |
| PCB | 676 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 1.73 |
| Seated Plane Height (mm) | 2.23 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAL-1 |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 348 |
| Number of Registers | 93296 |
| RAM Bits | 3096Kbit |
| Device Logic Cells | 74637 |
| Process Technology | 45nm |
| Number of Multipliers | 264 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 8 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 132 |
| PCI Blocks | 1 |
| Speed Grade | 3 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 172 |
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Xilinx XC6SLX75T-3FG676I to view detailed technical specifications.
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