Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers. Features 3096 Kbit RAM bits, 132 dedicated DSP slices, and 264 18x18 multipliers. This 45nm technology device offers 268 user I/Os and 8 transceiver blocks operating at 3.2 Gbps. Housed in a 484-pin Fine Pitch Ball Grid Array (FBGA) package, it supports surface mount installation and operates between 0°C and 85°C.
PackageFBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75T-3FGG484C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 484 |
| PCB | 484 |
| Package Length (mm) | 23 |
| Package Width (mm) | 23 |
| Package Height (mm) | 1.7 |
| Seated Plane Height (mm) | 2.2 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 268 |
| Number of Registers | 93296 |
| RAM Bits | 3096Kbit |
| Device Logic Cells | 74637 |
| Process Technology | 45nm |
| Number of Multipliers | 264 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 8 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 132 |
| PCI Blocks | 1 |
| Speed Grade | 3 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 172 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX75T-3FGG484C Datasheet
Download the complete datasheet for Xilinx XC6SLX75T-3FGG484C to view detailed technical specifications.
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