Field Programmable Gate Array (FPGA) with 74,637 logic cells and 93,296 registers, featuring 3096 Kbit RAM and 132 dedicated DSP slices. This device utilizes 45nm process technology, offers 160 maximum user I/Os, and includes 8 transceiver blocks operating at 3.2 Gbps. Packaged in a 225-pin Chip Scale Ball Grid Array (CSBGA) with a 0.8mm pin pitch, it supports surface mount installation and operates within a temperature range of -40°C to 100°C. Additional features include 264 (18x18) multipliers, 1 PCI block, and 18 DLLs/PLLs.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX75T-4CSG225I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 225 |
| PCB | 225 |
| Package Length (mm) | 13 |
| Package Width (mm) | 13 |
| Package Height (mm) | 0.9 |
| Seated Plane Height (mm) | 1.4(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Spartan®-6 LXT |
| Maximum Number of User I/Os | 160 |
| Number of Registers | 93296 |
| RAM Bits | 3096Kbit |
| Device Logic Cells | 74637 |
| Process Technology | 45nm |
| Number of Multipliers | 264 (18x18) |
| Programmability | Yes |
| Transceiver Blocks | 8 |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 132 |
| PCI Blocks | 1 |
| Speed Grade | 4 |
| Device Number of DLLs/PLLs | 18 |
| Total Number of Block RAM | 172 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Xilinx XC6SLX75T-4CSG225I Datasheet
Download the complete datasheet for Xilinx XC6SLX75T-4CSG225I to view detailed technical specifications.
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