Field Programmable Gate Array (FPGA) with 9152 logic cells and 45nm process technology. Features 498 user I/Os, 11440 registers, 576 Kbit RAM, and 32 (18x18) multipliers. Includes 16 dedicated DSP slices and 6 DLLs/PLLs. Operates across a -40 °C to 100 °C temperature range. Packaged in a 676-pin Fine Pitch Ball Grid Array (FBGA) for surface mounting.
PackageFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Xilinx XC6SLX9-3FG676I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
676
PCB
676
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.73
Seated Plane Height (mm)
2.23
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAL-1
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
498
Number of Registers
11440
RAM Bits
576Kbit
Device Logic Cells
9152
Process Technology
45nm
Number of Multipliers
32 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
16
Speed Grade
3
Device Number of DLLs/PLLs
6
Total Number of Block RAM
32
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX9-3FG676I Datasheet
Download the complete datasheet for Xilinx XC6SLX9-3FG676I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.