Field Programmable Gate Array (FPGA) with 9152 logic cells and 11440 registers, built on 45nm process technology. Features 576 Kbit RAM, 32 (18x18) multipliers, and 16 dedicated DSP blocks. Offers 186 maximum user I/Os and supports external memory interfaces including DDR, DDR2, DDR3, and LPDDR SDRAM. Packaged in a 256-pin FTBGA (Fine Pitch Thin Ball Grid Array) with a 17mm x 17mm footprint, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
PackageFTBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX9-3FTG256C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FTBGA
Package Description
Fine Pitch Thin Ball Grid Array
Lead Shape
Ball
Pin Count
256
PCB
256
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1
Seated Plane Height (mm)
1.4
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Package Orientation
Yes
Package Orientation Marking Type
Dot
Jedec
MS-034AAF-1
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
186
Number of Registers
11440
RAM Bits
576Kbit
Device Logic Cells
9152
Process Technology
45nm
Number of Multipliers
32 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
16
Speed Grade
3
External Memory Interface
DDR SDRAM|DDR2 SDRAM|DDR3 SDRAM|LPDDR SDRAM
Device Number of DLLs/PLLs
6
Total Number of Block RAM
32
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX9-3FTG256C Datasheet
Download the complete datasheet for Xilinx XC6SLX9-3FTG256C to view detailed technical specifications.
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