Field Programmable Gate Array (FPGA) with 9152 logic cells and 11440 registers, built on 45nm process technology. Features 576 Kbit RAM, 32 multipliers (18x18), and 16 dedicated DSP blocks. Offers 576 user I/Os and 6 DLLs/PLLs, with transceiver speeds up to 3.2 Gbps. Packaged in a 900-pin Fine Pitch Ball Grid Array (FBGA) measuring 31x31mm with a 1mm pin pitch, suitable for surface mounting. Operates within a temperature range of 0°C to 85°C.
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Xilinx XC6SLX9-L1FG900C technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 900 |
| PCB | 900 |
| Package Length (mm) | 31 |
| Package Width (mm) | 31 |
| Package Height (mm) | 1.75 |
| Seated Plane Height (mm) | 2.25 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034 |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 576 |
| Number of Registers | 11440 |
| RAM Bits | 576Kbit |
| Device Logic Cells | 9152 |
| Process Technology | 45nm |
| Number of Multipliers | 32 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 16 |
| Speed Grade | 1L |
| Device Number of DLLs/PLLs | 6 |
| Total Number of Block RAM | 32 |
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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