Field Programmable Gate Array (FPGA) with 128,000 logic cells and 160,000 registers, built on 40nm process technology. Features 9504 Kbit RAM, 480 dedicated DSP slices with 25x18 multipliers, and 16 transceiver blocks operating at 3.75 Gbps. This surface-mount device utilizes a 784-pin Flip Chip Ball Grid Array (FCBGA) package measuring 29mm x 29mm, with a maximum height of 2.5mm. Offers 400 user I/Os, 1 Ethernet MAC, and 2 PCI blocks, operating within a temperature range of 0°C to 85°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6VCX130T-1FF784C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 784 |
| PCB | 784 |
| Package Length (mm) | 29 |
| Package Width (mm) | 29 |
| Package Height (mm) | 2.5(Max) |
| Seated Plane Height (mm) | 3.1(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Virtex®-6 CXT |
| Maximum Number of User I/Os | 400 |
| Number of Registers | 160000 |
| RAM Bits | 9504Kbit |
| Device Logic Cells | 128000 |
| Process Technology | 40nm |
| Ethernet MACs | 1 |
| Number of Multipliers | 480 (25x18) |
| Programmability | Yes |
| Transceiver Blocks | 16 |
| Transceiver Speed | 3.75Gbps |
| Program Memory Type | Flash |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 480 |
| PCI Blocks | 2 |
| Speed Grade | 1 |
| Total Number of Block RAM | 264 |
Compliance
| Cage Code | 68994 |
| EU RoHS | No |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6VCX130T-1FF784C Datasheet
Download the complete datasheet for Xilinx XC6VCX130T-1FF784C to view detailed technical specifications.
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